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Re: Desoldering surface-mounted components: Advice sought
- Subject: Re: Desoldering surface-mounted components: Advice sought
- From: Frank Carney <frankcNOSPAM@cyberhighway.net>
- Date: 1998/12/31
- Newsgroups: comp.sys.apple2
- Organization: Cyberhighway Internet
- References: <767iok$272u$3@lynx.unm.edu> <david.915070850@duckula>
Yes, the air gun is best, but you run the risk of causing the board to
bubble and seperate! The hot air guns are expensive too. However, when
I worked on surface mount boards (Megahertz PCMCIA modems) many of the
techs used a long thin tip in their iron with a fine solder wick. Also,
flux comes in handy. I think it is flux that helps solder to melt.
Anyway, I have seen huge chips removed with just a good iron with
temperature control and a thin tip. Good luck.
By the way, it is kind of cool to see a pcmcia board with a bubble in
the center. : )
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