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Re: Hacking: bisection of IIC motherboard to install IIC in Mac casing
In <D0po97.K1F@presby.edu> sebugg@presby.edu (Stephen Buggie) writes:
>Last year, I installed a harddrive in a classic Disk ][ casing. Now, I
>am thinking again about installing a IIC inside a Mac casing. The Mac SE,
>in particular is very roomy.
>
>The obstacle remains the fit of the IIC motherboard inside the
>Mac case. Its slightly too big. But I am considering butchering the
>IIc motherboard by slicing it in half, using spacers to "double-deck"
>the two halves, then running soldered wires to connect the corresponding
>points at the split edge of the motherboard.
>
>HACKING QUESTIONS:
>
>(a) Is it feasible to split the motherboard, then reconnect the tracings
>with soldered wire jumpers? I have silver solder and have successfully
>desoldered RAM chips from the IIC board.
>
>(b) Assuming that all severed points on the motherboard are reconnected
>successfully, are there any electrical complications? For example, any
>circuits which will be messed up by several inches of additional wire in
>their circuits? Another anticipated complication is the possibility that
>the motherboard is multi-layered with buried tracings. Anyone know for
>sure? In other words, are the tracings along the surface (where wires can
>be attached), or are they buried inside the green resin board?
>
>(c) The direction of the cut will be in areas of the board with the lowest
>density of traces and components. Any suggestions?
>
>(d) The board will be cut with a sharp hacksaw blade on a power saw.
>Will the vibration of the saw be risky to components or traces, or should
>I saw the board manually instead?
AGHH!!! An Apple II Mutilator in our midst!!
I can offer no info on what you propose, other that advise against it.
I've had experience with fixing circuit cards with cracked boards/traces.
They are a nightmare.
Intentionally cutting the card goes against my "grain"
HAVE YOU NO SHAME!!! NEXT YOU'LL BE GETTING A MAC OR HEAVEN FORBID USING A
ibm machine. :-)
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