a2aviator@gmail.com wrote:
Yes, they are very similar in construction, tis why I mentioned applied heat to the lead itself. With one exception, use some method of solder resist on the lower half of the exposed lead so that it does not get tinned if possible. Because of course the solder will want to flow towards the heat source.
Since I'm planning to run the chip solely in a ZIF socket, I don't think it makes any difference whether or not I end up tinning the lower portion of the leads. I can clean off any significant buildup with a bit of solderwick.
Thats if you don't expose the joint itself, you can then just go in with a 1/64" tip and hit it right on the spot.
That will definitely be a last resort. I'm hoping to avoid grinding into the epoxy.