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Re: IIGS MOTHERBOARD: Which components are heat-sensitive?
- Subject: Re: IIGS MOTHERBOARD: Which components are heat-sensitive?
- From: supertimer@aol.com (Supertimer)
- Date: 1998/07/25
- Newsgroups: comp.sys.apple2
- Organization: AOL http://www.aol.com
- References: <6pcrv3$1gs6$3@lynx.unm.edu>
buggie@indus.unm.edu (stephen e buggie) wrote:
>Someone contacted me in reply to my previous post ---- asking if I could
>replace the standard RAM with fast RAM. Yes, but its not recommended ----
>too risky.
Steve, the way I would do it is to cut off the legs of the dead chip and
then individually desolder the leg stubs from the motherboard using
a soldering iron and a copper wick.
Regarding surface mounted components, I have never successfully
desoldered one of these, but I think there are tools that mount onto
soldering irons in place of the tips. They wrap around the perimeter
of the surface mounted chip and heat all the legs evenly. When the
solder melts, the component falls off.
The Ensoniq is a socketed chip on ROM 01 units (or ROM 00).