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IIGS MOTHERBOARD: Which components are heat-sensitive?
- Subject: IIGS MOTHERBOARD: Which components are heat-sensitive?
- From: buggie@indus.unm.edu (stephen e buggie)
- Date: 1998/07/25
- Newsgroups: comp.sys.apple2
- Organization: University of New Mexico, Albuquerque
Now that I've learned improved desoldering techniques, I plan to remove
the reusable components from two dead IIgs motherboards I have cluttering
up the place.
But which components on the GS motherboard are most sensitive to heat?
What about the Ensoniq sound chip?
Has anyone ever attempted desoldering of surface-mount components such as
the IIe mega-chip on the IIgs motherboard? I subscribe to the magazine,
SURFACE MOUNT TECHNOLOGY, but they have never yet had an article on
hobbiest desoldering! I'd like to be able to remove a SMT component, the
IWM chip drive-controller.
Someone contacted me in reply to my previous post ---- asking if I could
replace the standard RAM with fast RAM. Yes, but its not recommended ----
too risky.
My desoldering skills have improved, but are not perfect. The level I am
at is to desolder components from dead boards, or to attempt to fix a dead
board. I'd be _reluctant_ to desolder/hack a perfectly working board!
Steve "solder slinger" Buggie
Stephen Buggie |Sorry sir, "APPLE II |
Psychology Dept. | FOR DUMMIES" was |
Univ. of New Mexico, Gallup | never published; |
200 College Rd. |could you get the IBM|
Gallup, NM 87301 | version instead? |
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** buggie@unm.edu voice: (505) 863-7504 or 863-2390 **
** IIgs/IIc/IIe loyalist **
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