Re: IIGS KEYBOARD SOCKETS --- strengthening

[Paul Schultz <pschultz@med.wayne.edu>]

On 16 Dec 1998, stephen e buggie wrote:

> QUESTION:in reassembling, would the connectors be strengthened by
> surrounding them (after solder re-melt) with non-conducting adhesive
> caulk?
> 

Stephen,

I recently read a post (either here or on Delphi) that this in fact
does help relieve some of the stress on the connection. In fact, I
think that the user stated they used hot glue. They simply piled it
on so that everything was snug around the connector after re-assembly.

Paul.

pschultz@med.wayne.edu
Paul Schultz