Re: GS in desktop case

[sbeattie@sparc5.augustana.edu (Shawn Beattie)]

In article <4qfm84$22v@nyx10.cs.du.edu>,
Will Baguhn (wbaguhn@nyx10.cs.du.edu) wrote:

>Hot-melt glue is an interesting solution... until you consider that it
>turns liquid and loses it's adhesive properties when it gets too warm.

I don't think the underside of the motherboard sees temps higher than 30-35 C,
at least from my experience.  I think hot glue needs to be 80 or 90 deg C
before it gets soft.  The metal case that it is glued to dissipates heat
pretty well.  And the GS will crash long before it gets warm enough anyway.

-Shawn