Mark McDougall wrote:
Michael J. Mahon wrote:All good points. With newer, higher-density packaging, it's almost a requirement to go at least 4-layer. I hadn't considered the "small lot" problem for chips, but it certainly makes sense. And manually soldering high-density surface-mount chips is a losing proposition.That's nothing - we're looking at doing a new board (for fun) with 672 pin FPGA and that will require 10 layers!
Sounds right. It gets to be an expensive hobby, eh? Now what will we do when we want to run a few dozen wafers and need access to a .13 micron fab... ;-) -michael Music synthesis for 8-bit Apple II's! Home page: http://members.aol.com/MJMahon/ "The wastebasket is our most important design tool--and it is seriously underused."